WaferSense Airborne Particle Sensor (APS) Rental - 300mmDetect particles in real-time without opening the tool, so you don’t need to expose process areas to the environment. The APS wafer is used for rapid tool partitioning and segmentation.
Reports particles in 0.14μm and 0.5μm bin sizes and larger particles in 2, 5, 10 and 30 μm bin sizes.
Available in 300mm wafer sizes.
Transmits particle data to your laptop or PC in real-time.
Software provides the user with real-time visual feedback and can record and replay logged data for review and analysis.
Raw data also saved in CSV format for analysis.
WaferSense Auto Multi Sensor (AMS) Rental - 300mmCollect and display acceleration, vibration, leveling and humidity data. Monitor humidity in wafer environments. Use the Auto Multi Sensor with CyberSpectrum™ software for real-time equipment diagnostics. See the effects of adjustments in real-time, speeding equipment alignment and set-up.Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.
Thinner 4.5mm form factor provides access to more chambers. Operates at higher temperatures. Keep the process areas unexposed to the fab environment with vacuum compatible AMS.
Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.
Take the human element out of adjusting your equipment with objective measurements for multiple applications in one. Make the right adjustments time after time. Receive early warning for impending equipment failures and optimize your preventative maintenance plans.
WaferSense Auto Vibration and Leveling Sensor (AVLS3) Rental - 300mmSpeed equipment qualification with wireless measurements.Collect and display acceleration, vibration and leveling data. Use the AVLS3 real-time equipment diagnostics. See the effects of calibrations in real-time, speeding equipment alignment and set-up.
Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.
Access more chambers with the thin 3.5mm form factor. Enable smooth wafer handling and improved vacuum chucking with the new Chemically Hardened Glass (CHG) substrate. Keep the process areas unexposed to the fab environment with vacuum compatible AVLS3.
New AVLS3H model provides improved usage with three point non-symmetrical edge chucks, seen in furnace and other applications.Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.
Take the human element out of calibrating equipment with objective measurements for multiple applications in one. Make the right adjustments time after time. Receive early warning for impending equipment failures and optimize your preventative maintenance plans.
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