Wafer Expander

Model TEX-220

Realize “excellent workability” that the operator demands!

The TEX-220 is a wafer expansion system equipped with an automatic cutting function. The separation work with the extra film (dicing frame) is done with “only pressing the switch”.

Model TEX-220 is a wafer expansion device with an auto-cut function that can reduce the work of the operator and yield a higher throughput.

System Specifications

Model Wafer Size Footprint
TEX-220 Up to 8″ Wafers (200 mm) 420 mm (W) x 675 (D) x 480 (H)

Systems Features

  • Expansion rate can be set by user.
  • The expansion speed can be set by user.
  • Hot plate mounting stage enables high expansion rate.
  • Automatic grip of the expanded film with the grip ring.
  • Automatic film cutting mechanism.

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