Our wafer mounting systems laminate tape/film to wafer and dicing frames without bubbles prior to the singulation/dicing process. Repeatable and stable process of wafer mounter improves the yield.
We offer a wide range of wafer mounting equipment from R&D to semi-production. Please see our product offerings listed below.
- Manual Wafer Mounting Systems (224 Series)Our manual wafer mounter series supports three different sizes of wafers: 300mm (12″), 200mm (8″), and 150mm (6″).
These manual wafer mounting systems can be manufactured for either dicing film lamination or back grind film lamination.
Our wafer mounters can be used for wafers as well as packaging, glass, ceramic, and various other types of substrates. They can also be customized to meet special user specifications if needed.
- Wafer Mounting Systems (334 Series)The 334 series wafer mounter is ideal for diversified tape application and lamination conditions. This model meets user requirements for manual operation that is automated for only critical application work and that allows for user-settable application conditions and quantitative control of quality.
- Semi-automatic Wafer Mounting Systems (664 Series)This model was developed for both pre-cut and normal tape.
The industry’s first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted for the following applications.
Mode FM-6643 : 300mm (12 inch) semi-automatic wafer mounter
Mode FM-6648 : 200mm (8 inch) semi-automatic wafer mounter
- Semi-automatic Wafer Mounting Systems (903 Series)FM-903 is normal type semi-automatic wafer mounter up to 8 inch (200mm) size of substrates. Automatic operation means the operator is required only for loading and unloading samples. This contributes to stable tape and film application work and provides greater yield.
It laminates the dicing tape on the back for holding the chip after dicing the wafer.
For DAF (Die Attached Film)
It laminates adhesive tape (DAF) for fixing to the substrate before die-bonding chips.
For protection (Back Grinding)
It laminates the tape for protection circuit to protect the surface when grinding the back of the wafer
for thinning of the wafer.
– Support tape ( film )
Dual purpose equipment for normal tape and pre-cut tape.
Dedicated equipment for normal tape.
Dedicated equipment for pre-cut tape.
– Wafer size
Available in 12 inch (300mm), 8 inch (200mm), 6inch (150mm).
The wafer mounter is available in the following four basic series, with selectable functions
and wafer sizes.
・FM-224 series (manual)
・FM-334 series (semi-automatic) : Small table-top
・FM-664 series (semi-automatic) : Both pre-cut tape and normal tape support
・FM-903 series (semi-automatic) : Dedicated for normal tape