LED UV CURING SYSTEM

MODEL UVC-300

LED UV curing performance, rather surpassing that of conventional system with built-in High-pressure Hg lamp or Metal halide lamp, while the UV light intensity maybe regarded as less than that of the conventional systems. The model UVC-300 can process up to 300mm (12 inch) wafers using LED (Light Emitting Diode) UV Lights and is equipped with a nitrogen purge function. This system is also available for customized specifications, such as UV irradiated of top or bottom sides of your wafers. We can also design this system for modular applications to be inline with the other systems in your lab or cleanroom.

There are numerous LED benefits such as less damage to the workpiece by exposure at ambient temperature, very long lifetime, low power consumption and safety for replacing the light source because it does not get hot compared to mercury lamps. Equipped with high-output LED driver, we can achieve an exposure output of 250mW/cm2 (at 10mm work distance).

Automatic LED UV Curing System (Cassette to Cassette) C-to-C is also available.

System Features

Applications

  • Applicable for all UV films with 365nm wavelength
  • Can process up to 300mm (12″) wafers
  • Near room temperature process
  • Uniform UV (ultraviolet) radiation over the entire sample stage
  • Small and Lightweight tabletop system
  • Allows complete curing of film surface by means of Nitrogen (N2) purge
  • Simple operation with a safety interlocks
  • Drawer loading mechanism
  • Built-in cooling fan
  • Built-in process timer and UV lamp hour counter
  • No UV light source replacement required for more than 10 years
  • Dimensions : 750(W)×600(D)×570(H) mm
  • UV-curable pressure sensitive adhesives (PSA)
  • Wire tacking
  • Surface mount bonding for speakers
  • Die attachments
  • Pin attachments
  • Sealing and gasketing products
  • Flex circuit reinforcement and relief
  • Ferrite magnet bonding
  • Flip chips
  • UV Curing of inks and coatings on:
    • Printed circuit boards
    • Wires
    • Computer chips
    • Cellphone, OLEDs and semiconductors
    • Cables
    • Ribbon cables
    • Pins
    • Smart cards
    • Displays
    • Video tape recorders
    • Motors
    • Disk drives
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