UV-Ozone Cleaning System, Model UV-312

300mm UV-Ozone Cleaner

MODEL UV-312

The UV-Ozone Cleaning System, Model UV-312 has a 308mm x 308mm sample stage and removes organic contaminants from semiconductor wafer surfaces. It can also be used for surface activation and modification. This system utilizes a dry cleaning process and is best used in final cleaning steps for the removal of trace organics.

Change of Contact Angle: Exposure Time: 5min, Distance: 10mm, Sample: Si Wafer

System Features

Applications

Equipped with a high-density, ozone-producing UV grid lamp
Variable distance between the UV light source and sample stage
Uniformly clean 12-inch, 8-inch or multiple 4-inch wafers
Low-temperature wafer cleaning
Compact footprint at 505mm(W) x 616mm(D) x 320mm(H)
Very easy to operate
Applicable to both double-side and single-side wafer cleaning
Simple operation with a safety lock function
Drawer loading mechanism
Built-in exhaust fan
Built-in process timer, purge timer, and UV lamp hour counter
Weight: Approx. 41 kg (~ 90 lbs)
Electricity: 100VAC, 10A, 50/60 Hz

Cleaning Silicon and Silicon Nitride AFM/SPM Probes
Ultraviolet Curing of UV-adhesives
UV photo-patterning of SAM surfaces
Cleaning Surface Plasmon Resonance (SPR) chips
Cleaning Quartz Crystal Micro-balance (QCM) sensors
Wafer Cleaning
Surface Oxidation and Preparation
Improving Surface Hydrophilicity
Surface Cleaning
Preparation for Thin Film Deposition
Surface Patterning and Sterilization
Cleaning Lenses and Optics
Bonding and oxidizing PDMS
Cleaning MEMS and Glass Devices

300mm UV-Ozone Cleaner

System Features

Applications

Request a Quote for UV-Ozone Cleaner, Model UV-312