Manual Wafer Mounting Systems

Model 224 Series

We have a wide range of manual wafer mounting systems available for various applications, from research and development to semi-custom production. The manual wafer mounter series supports three different wafer sizes: 300mm, 200mm, and 150mm and can be manufactured for either dicing film or back grind film lamination.

Our manual wafer mounting systems can also be used in packaging, glass, ceramic, and various other types of substrates, and can also be customized to meet special user specifications.

A twin-type manual wafer mounter is also available. With this special model, you can simultaneously set two tapes or films, such as a normal adhesive tape and a UV tape, on a single wafer mounter. This eliminates the need to change tapes.

Model FM-2248-BG

System Operation Video

System Features

Available Models

  • Instantaneous bubble-free lamination
  • Built-in automatic balancing mechanism for lamination roller
  • Built-in circular cutter
  • Built-in horizontal cutter
  • Built-in separator winding mechanism
  • Wide variety of options (hot chuck, non-contact surface chuck, measures against static electricity, and more)
System ModelApplication/Wafer Size
Model FM-2243
Model FM-2248
Model FM-2246
For Dicing (300mm / 12″ wafers)
For Dicing (200mm / 8″ wafers)
For Dicing (150mm / 6″ wafers)
Model FM-2243-BG
Model FM-2248-BG
Model FM-2246-BG
For back grind (BG) films (300mm / 12″ wafers)
For back grind (BG) films (200mm / 8″ wafers)
For back grind (BG) films (150mm / 6″ wafers)

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