Wafer Mounting System (Semi-Automatic)

Model FM-903 Wafer Mounter

FM-903 is normal type semi-automatic wafer mounter up to 8 inch (200mm) size of substrates.

Automatic operation means the operator is required only for loading and unloading samples. This contributes to stable tape and film application work and provides greater yield.

System Features

Applications

  • Compatible with general adhesive tape and blue tape
  • Compatible with UV tape
  • Variable application pressure
  • Variable application speed
  • Automatic balancing function for application roller
  • Can be customized for non-contact surface application
  • Can be customized for hot wafer chuck
  • Can be customized for measures against static electricity
  • Can be customized to meet other user specifications
  • For dicing process
  • For DAF (die-bonding film)
  • For back grind (BG) film

Request a Quote for Wafer Mounting Systems

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