Wireless Leveling and Vibration Multi-Sensor Wafer
Advanced high-precision Leveling & Vibration Measurement Device

Wireless Leveling and Vibration Wafer

Wireless, thin and lightweight, wafer-shaped, real-time measurements. Available in 200mm and 300mm.

When you need the most efficient and effective measurement devices for semiconductor tool set-up and maintenance processes, count on our wireless Leveling and Vibration Multi-Sensor wafer measurement devices. These wafers are vacuum compatible, wireless, very thin, lightweight, and provide data in real-time.

Semiconductor fabs and OEMs value the accuracy, precision and versatility of these metrology wafers to enable improvements in fab yields and reduce wafer processing equipment downtime.

ALVMD (Advanced Leveling and Vibration Measurement Device) can improve Process yield and ROI by measuring and managing level inside semiconductor equipment by providing real-time data measurement.

Wafer Size and Material:	200mm and 300mm (±0.05), Carbon Fiber
Wafer Thickness and Weight:	3.5mm, 150 grams
Operating Pressure:	10e^-6 to 760 Torr
Operating Temperature:	20 to 60℃ – Leveling 20 to 70℃ – Vibration
Battery Life:	Over 3 hours
Accuracy and Units:	Leveling: Absolute X, Y ±0.03 degrees within ±0.7 degrees Units: degree, milliradian, mm/d and mm/r Vibration: Range: ±2G Resolution: ±0.02G Data sampling: 1 ms (1,000 data points per second) Frequency: FFT Analysis (0-200 Hz) Units: G, gal
Software:	View: Real-time level check, Auto mark function, Review: Replay Log File, Auto report function. Windows 7, 8, 10, 11 View: Real-time Vibration, Frequency check, Auto mark function, Review: Replay Log File, Auto report function.
Wireless Communication:	Bluetooth, Class 1, 2.4GHz
What’s Included:	Leveling and Vibration combo Wafer, Charging case, Link Module, USB cable, Charging cable, Software, Carrying case.

Wireless Leveling and Vibration Multi-Sensor Wafer

Wireless Leveling and Vibration Wafer

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