UV-LED Spot Curing System

Control up to Four UV-LED Curing Heads Independently

UVFAB’s high-intensity UV LED spot-curing system features all the benefits of UV LED-curing technology in a much smaller, more versatile unit. This system is comprised of a controller with a foot switch and up to four UV-LED heads. UV LED heads are available in 365nm, 385nm, 395nm and 405 nm which can be outfitted with 8mm diameter focusing lenses. LED heads and focusing lenses can be used in any combination and individually controlled. Individual exposure times and intensity settings can be used for each UV LED head, giving users maximum curing flexibility.

UVFAB UV-LED spot curing system generates curing energy using high-intensity UV-LED instead of conventional metal-halide or mercury-arc lamps. The relatively narrow waveband of energy emitted by UV LED results in cooler substrate temperatures compared to traditional UV lamp systems, making them ideal for curing thermally sensitive materials. UVFAB LED UV curing systems offer many energy and cost-saving benefits, such as no warm-up period, lower energy consumption, no bulbs to change, and more consistent wavelength and intensity output for better process control.

In addition to the curing flexibility, this system also features an easy-to-use control interface that allows flexibility in setup and use of the unit. The spot curing system can be activated by a foot pedal or by the user interface.

System Features

Applications

  • Lens Size: 8mm in diameter
  • Spot Diameter: φ8mm
  • UV LED Light Intensity: up to 6,800 mW/cm2 at 27mm irradiation distance
  • UV LED Intensity Control: Dimmable 10%-100%
  • Instant on/off; low power consumption
  • No Filters required; no replacement lamps
  • Available in 365nm, 385nm, 395nm, and 405nm Ultraviolet (UV) wavelengths
  • Cooling Method: Aluminum body, air-cooled
  • Input Voltage: 120VAC/60Hz or 220VAC/50Hz
  • Operating Voltage: 7.5-36 VDC
  • Power Consumption: 50VA
  • Footprint: 166 x 100 x 138 mm (LxWxH)
  • Weight: 5.5 lb
  • Hard disk assembly (Read-write head packaging, gold wire fixation, bearing, coil, chip bonding, etc.)
  • Assembly of motors and components (Wire, coil fixed, coil end fixed, PTC/NTC components bonding, protect transformer core)
  • DVD/Digital Camera (Lens, lens pasting, circuit board reinforcement)
  • Sensor production (Gas sensor, photoelectric sensor, optical fiber sensor, photoelectric encoder, etc.)
  • Assembly of cell phone components (Camera lens, receiver, microphone, shell, liquid crystal module, touch screen coating, etc.)
  • TFT-LCD pasting and packaging of LCD panel FPC
  • UV LED light curing application of PCB
  • UV LED light curing application of Optics Series
  • Optical element assembly (Lens group, prism, DLP optical engine assembly, CCD, COMS)
  • Optical communication industry components (All kinds of glass packaging structures are bonded or sealed, the fixation of tiny components, etc.. Such as PLC Branching Unit, WDM, AWG, etc.)
  • UV LED light curing application of Research Institutes
  • Medical device and medical accessories LED UV light source curing application
  • Capacitive touch screen adhered to curing
  • UV encapsulation and curing application of laser

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