The Ultraviolet Curing system, Model UVC-512 can support up to 300mm (12-inch) wafers. This system includes a 2KW high-pressure mercury UV lamp with a uniform curing process due to the rotating sample stage.

System Features


  • Equipped with a 2 KW high-pressure mercury UV light source
  • Can process up to 300mm (12″) wafers
  • Low-temperature UV exposure
  • Uniform exposure with rotating sample stage
  • Small, compact footprint
  • Allows complete curing of film surface by means of Nitrogen (N2) purge
  • Simple operation with a safety interlocks
  • Drawer loading mechanism
  • Built-in cooling fan
  • Built-in process timer and UV lamp hour counter
  • Peak wavelength: 365nm
  • System dimensions: 650(W) x 810(D) x 1195(H) mm
  • UV-curable pressure sensitive adhesives (PSA)
  • Wire tacking
  • Surface mount bonding for speakers
  • Die attachments
  • Pin attachments
  • Sealing and gasketing products
  • Flex circuit reinforcement and relief
  • Ferrite magnet bonding
  • Flip chips
  • UV Curing of inks and coatings on:
    • Printed circuit boards
    • Wires
    • Computer chips
    • Cellphone, OLEDs and semiconductors
    • Cables
    • Ribbon cables
    • Pins
    • Smart cards
    • Displays
    • Video tape recorders
    • Motors
    • Disk drives

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