System Features
Applications
- Equipped with a 2 KW high-pressure mercury UV light source
- Can process up to 300mm (12″) wafers
- Low-temperature UV exposure
- Uniform exposure with rotating sample stage
- Small, compact footprint
- Allows complete curing of film surface by means of Nitrogen (N2) purge
- Simple operation with a safety interlocks
- Drawer loading mechanism
- Built-in cooling fan
- Built-in process timer and UV lamp hour counter
- Peak wavelength: 365nm
- System dimensions: 650(W) x 810(D) x 1195(H) mm
- UV-curable pressure sensitive adhesives (PSA)
- Wire tacking
- Surface mount bonding for speakers
- Die attachments
- Pin attachments
- Sealing and gasketing products
- Flex circuit reinforcement and relief
- Ferrite magnet bonding
- Flip chips
- UV Curing of inks and coatings on:
- Printed circuit boards
- Wires
- Computer chips
- Cellphone, OLEDs and semiconductors
- Cables
- Ribbon cables
- Pins
- Smart cards
- Displays
- Video tape recorders
- Motors
- Disk drives